Simple estimate of electromigration failure in metallic thin films
Simple estimate of electromigration failure in metallic thin films
复制标题
金属薄膜电迁移失效的简单估计
DOI:
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发表时间:
1982
期刊:
影响因子:
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通讯作者:
A. Mogro
中科院分区:
文献类型:
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作者:
A. Mogro
Electromigration failure in thin metallic films has been studied in detail for aluminum and gold. A simple expression is given here, which can be used to provide rough estimates of median time to failure for thin films of other metals, when experimental information on them is not available.