A 105Gb/s Dielectric-Waveguide Link in 130nm BiCMOS Using Channelized 220-to-335GHz Signal and Integrated Waveguide Coupler
A 105Gb/s Dielectric-Waveguide Link in 130nm BiCMOS Using Channelized 220-to-335GHz Signal and Integrated Waveguide Coupler
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使用通道化 220 至 335GHz 信号和集成波导耦合器的 130nm BiCMOS 中的 105Gb/s 介质波导链路
DOI：
10.1109/isscc42613.2021.9365857
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发表时间：
2021
期刊：
影响因子：
--
通讯作者：
R. Han
中科院分区：
文献类型：
--
作者：
J. Holloway;G. Dogiamis;R. Han
计算、存储和通信基础设施内数据传输的快速激增正在推动传统铜基电气链路的速度边界。最近实现的100 Gb/s有线链路需要先进的FinFET技术、高成本的封装/电缆和功耗均衡。介质波导上的高频波被认为是一种替代解决方案，它利用低损耗、宽带介质，同时保持与现有硅1C平台的兼容性。然而，自2011年首次亮相[1]以来，这种以前使用$\leq 140\mathrm {G}\mathrm{H}\mathrm{z}$载波的方案仅实现了高达36 Gb/s的数据速率[2]。预期更高的载波频率（例如，> 200 GHz）和多信道聚合将进一步增加数据速率，同时缩小互连尺寸;但是该方案受到与在亚太赫兹（sub-THz）频率下有效操作的所需高阶复用器和超宽带波导耦合器相关的挑战的阻碍。本文采用130 nm SiGe BiCMOS工艺，设计了一种多通道、多路复用器/耦合器集成发射机（Tx），其数据速率为105\mathrm {G}\mathrm{B}/\mathrm{s}（3\times 35\mathrm {G}\mathrm{B}/\mathrm{s}）。为了解调每个信道，还开发了35 Gb/s耦合器集成接收机（Rx）。Ourlink，包括芯片组和一个0. 4毫米宽，30厘米长的介质带，实验证明了THz光纤链路在高速服务器间和背板结构中的潜在速度，效率，尺寸和成本优势。
The rapid surge of data transmission within computation, storage and communication infrastructures is pushing the speed boundary of traditional copper-based electrical links. Recent realizations of l00Gb/s wired links require advanced FinFET technologies, highcost packaging/cables and power-consuming equalization. High-frequency waves over dielectric waveguides have been considered as an alternative solution that exploits the low-loss, broadband medium while maintaining compatibility with existing silicon 1C platforms. However, since its debut in 2011 [1], this scheme, previously using $\leq 140\mathrm{G}\mathrm{H}\mathrm{z}$ carriers, has only achieved data rates of up to 36Gb/s[2]. lt is expected that higher carrier frequencies (e.g. >200GHz) and multi-channel aggregation would further increase the data rate while shrinking the interconnect size; but that scheme has been hindered by challenges related to the required high-order multiplexer and ultra-broadband waveguide coupler operating efficiently at sub terahertz (sub-THz) frequencies. in this paper, using a 130nmSiGe BiCMOS technology, we present a multi-channel, multiplexer/coupler-integrated transmitter (Tx) that delivers a data rate of $105\mathrm{G}\mathrm{b}/\mathrm{s}(3\times 35\mathrm{G}\mathrm{b}/\mathrm{s})$. To demodulate each channel, a 35Gb/s coupler-integrated receiver (Rx) is also developed. Ourlink, including the chipset and a 0. 4mm-wide, 30cm-long dielectric ribbon, experimentally demonstrates the potential speed, efficiency, size and cost advantages of THz fiber links in high-speed inter-server and backplane fabrics.