"Prediction of fatigue failure of 60Sn-40Pb Solder using Constitutive Equation for Cyclic Viscoplasticity" Proc. of 1994 WAW Symposia on Material & Mechanics in Electronic packaging for 21th Century. (in press).
"Prediction of fatigue failure of 60Sn-40Pb Solder using Constitutive Equation for Cyclic Viscoplasticity" Proc. of 1994 WAW Symposia on Material & Mechanics in Electronic packaging for 21th Century. (in press).
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“使用循环粘塑性本构方程预测 60Sn-40Pb 焊料的疲劳失效”Proc。
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