Ultrasonic Additive Manufacturing as a form-then-bond process for embedding electronic circuitry into a metal matrix
Ultrasonic Additive Manufacturing as a form-then-bond process for embedding electronic circuitry into a metal matrix
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DOI：
10.1016/j.jmapro.2018.03.027
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发表时间：
2018-04-01
影响因子：
6.2
通讯作者：
Engstrom, Daniel S.
中科院分区：
文献类型：
--
作者：
Bournias-Varotsis, Alkaios;Friel, Ross J.;Engstrom, Daniel S.
超声波增材制造（UAM）是一种混合制造工艺，涉及固态金属箔的逐层超声波焊接，并定期进行CNC加工，以实现所需的3D形状。UAM能够制造金属智能结构，因为它允许将各种组件嵌入到金属基质中，这是由于在层结合过程中遇到的高度塑性金属流动和相对较低的温度。为了进一步提高UAM的嵌入能力，本文研究了铝箔的超声波焊接，其中铝箔在粘合之前已加工出特征。这些预加工的特征可以逐层堆叠以在封装之前形成用于容纳易碎部件（例如电子电路）的袋。这种制造方法将UAM转变为“成型-然后粘合”工艺。通过研究UAM过程中铝箔的变形，开发了一个统计模型，该模型允许预测一组UAM工艺参数的预加工特征的最终位置、尺寸和公差。该模型的预测能力通过设计一个空腔来容纳电子元件（即表面贴装电阻器），然后将其封装在金属基质中来证明。我们还进一步强调了张力在UAM工艺中的重要性。目前的工作为创建一种新型系统铺平了道路，该系统用于制造嵌入到增材制造的复杂金属复合材料中的三维电子电路。
Ultrasonic Additive Manufacturing (UAM) is a hybrid manufacturing process that involves the layer-by-layer ultrasonic welding of metal foils in the solid state with periodic CNC machining to achieve the desired 3D shape. UAM enables the fabrication of metal smart structures, because it allows the embedding of various components into the metal matrix, due to the high degree of plastic metal flow and the relatively low temperatures encountered during the layer bonding process. To further the embedding capabilities of UAM, in this paper we examine the ultrasonic welding of aluminium foils with features machined prior to bonding. These pre-machined features can be stacked layer-by-layer to create pockets for the accommodation of fragile components, such as electronic circuitry, prior to encapsulation. This manufacturing approach transforms UAM into a "form-then bond" process. By studying the deformation of aluminium foils during UAM, a statistical model was developed that allowed the prediction of the final location, dimensions and tolerances of pre-machined features for a set of UAM process parameters. The predictive power of the model was demonstrated by designing a cavity to accommodate an electronic component (i.e. a surface mount resistor) prior to its encapsulation within the metal matrix. We also further emphasised the importance of the tensioning force in the UAM process. The current work paves the way for the creation of a novel system for the fabrication of three-dimensional electronic circuits embedded into an additively manufactured complex metal composite.