Enhanced adhesion of silica for epoxy molding compounds (EMCs) by plasma polymer coatings
Enhanced adhesion of silica for epoxy molding compounds (EMCs) by plasma polymer coatings
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DOI：
10.1163/156856102320252958
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发表时间：
2002-01-01
影响因子：
2.3
通讯作者：
Yoon, TH
中科院分区：
文献类型：
--
作者：
Roh, JH;Lee, JH;Yoon, TH
使用RF等离子体（13.56 MHz）通过等离子体聚合涂覆用于环氧模塑化合物（EMC）的二氧化硅，所述等离子体聚合是等离子体功率、气体压力和处理时间的函数。用于等离子体聚合物涂层的单体是1，3-二氨基丙烷、烯丙胺、吡咯、1，2-环氧-5-己烯、烯丙基甲基丙烯酸酯和烯丙醇。EMC样品由联苯环氧树脂、酚醛清漆、三苯基膦和等离子体聚合物涂覆的二氧化硅制备，并且二氧化硅的负载量控制为60wt%。EMC样品在175 ℃下固化4 h，并进行T-g、CTE和吸水率测量。通过测量EMC样品的弯曲强度来评价二氧化硅对环氧树脂的粘附性，并通过SEM分析了断裂表面。等离子体聚合物涂层的特征还在于通过FT-IR和涂层厚度测量。与对照样品（140 MPa）相比，具有1，3-二氨基丙烷和烯丙基胺的二氧化硅的等离子体聚合物涂层提高了EMC样品（167和165 MPa）的弯曲强度，并且表现出更高的T-g、更低的CTE和更低的吸水率。使用1，3-二氨基丙烷和烯丙胺等离子体聚合物涂层的增强的性质可以归因于等离子体聚合物涂层中的胺官能团。
Silica for epoxy molding compounds (EMCs) was coated via plasma polymerization using an RF plasma (13.56 MHz) as a function of the plasma power, gas pressure, and treatment time. The monomers utilized for the plasma polymer coatings were 1,3-diaminopropane, allylamine, pyrrole, 1,2-epoxy-5-hexene, allyl mercaptan, and allyl alcohol. The EMC samples were prepared from biphenyl epoxy resin, phenol novolac, triphenyl phosphine, and plasma polymer-coated silica, and the loading of silica was controlled to 60 wt%. The EMC samples were cured at 175 C for 4 h and subjected to T-g, CTE, and water absorption measurements. The adhesion of silica to epoxy resin was evaluated by measuring the flexural strength of EMC samples and the fracture surfaces were analyzed by SEM. Plasma polymer coatings were also characterized by FT-IR and coating thickness measurements. The plasma polymer coating of silica with 1,3-diaminopropane and allylamine enhanced the flexural strength of EMC samples (167 and 165 MPa), compared with the control sample (140 MPa), and exhibited a higher T-g, a lower CTE, and lower water absorption. The enhanced properties with 1,3-diaminopropane and allylamine plasma polymer coatings can be attributed to the amine functional groups in the plasma polymer coatings.