Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
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DOI：
10.1115/1.4049293
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发表时间：
2021-06-01
影响因子：
1.6
通讯作者：
Graham，Samuel
中科院分区：
文献类型：
--
作者：
Warzoha，Ronald J.;Wilson，Adam A.;Graham，Samuel
本文介绍了在电力电子应用中影响热降温的相关纳米尺度热传输过程。具体地说，我们强调了组成现代电子设备的材料层次中每一层纳米级热传输机制的重要性。这包括那些影响热传输的机制：(1)衬底，(2)界面和二维材料，以及(3)热传播材料。对于每一层材料，我们提供了最新工作的例子，这些工作(1)证明了热性能的改善和/或(2)提高了我们对材料结间纳米尺度热传输的相关性的理解。在结束我们的讨论时，我们强调了几个从纳米尺度热传输现象的考虑中受益的其他应用，包括射频电子学和神经形态计算。
This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at each layer in material hierarchies that make up modern electronic devices. This includes those mechanisms that impact thermal transport through: (1) substrates, (2) interfaces and two-dimensional materials, and (3) heat spreading materials. For each material layer, we provide examples of recent works that (1) demonstrate improvements in thermal performance and/or (2) improve our understanding of the relevance of nanoscale thermal transport across material junctions. We end our discussion by highlighting several additional applications that have benefited from a consideration of nanoscale thermal transport phenomena, including radio frequency (RF) electronics and neuromorphic computing.