Molecular Design of Epoxy Resins for Microelectronics Packaging
Molecular Design of Epoxy Resins for Microelectronics Packaging
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微电子封装用环氧树脂的分子设计
DOI：
10.1021/bk-1994-0579.ch017
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发表时间：
1995
期刊：
影响因子：
--
通讯作者：
M. Kaji
中科院分区：
文献类型：
--
作者：
M. Kaji
研究了环氧树脂的结构与性能之间的关系，以实现以下目标：（1）改善韧性，（2）低吸湿性，（3）增加耐热性，（4）低热膨胀，（5）降低高填料负载下环氧树脂的粘度。发现引入刚性基团，如4，4 '-联苯或2，6-萘部分，是改善断裂韧性的有效途径，并且萘基树脂有效地降低吸湿性，提高玻璃化转变温度和降低热膨胀。合成了几种熔融粘度较低的双酚型环氧树脂，并将其用作IC封装用模塑料。使用这些树脂的包装的抗裂性由于其较低的粘度而具有高的填料负载而显著地优越于上级。
The relation between the structure and properties of epoxy resins were investigated to achieve the followings, (1) improved toughness, (2) low moisture absorption, (3) increased heat resistance, (4) low thermal expansion, and (5) decreased viscosity of epoxy resins for high filler loading. It was found that introduction of a rigid group, such as 4, 4'-biphenyl or 2, 6-naphthalene moiety, was an effective way to improve fracture toughness, and the naphthalene based resins were effective for lowering moisture absorption, increasing glass transition temperature, and lowering thermal expansion. Several epoxy resins of the bisphenol type with lower melting viscosity were synthesized and used as molding compounds for IC packaging. Crack resistance of the packages using these resins was markedly superior owing to high filler loading due to their lower viscosity.