Diffuse interface models of solidification with convection: The choice of a finite interface thickness
Diffuse interface models of solidification with convection: The choice of a finite interface thickness
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DOI：
10.1140/epjst/e2019-900099-5
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发表时间：
2019-09
期刊：
影响因子：
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通讯作者：
A. Subhedar;P. Galenko;F. Varnik
中科院分区：
文献类型：
--
作者：
A. Subhedar;P. Galenko;F. Varnik
薄界面限制的目的是尽量减少所产生的影响，从一个数值界面厚度，固有的扩散界面模型的凝固和微观结构的演变，如相场模型。虽然这个问题的原始配方被限制为扩散运输，我们认为在这里的情况下，熔体对流。使用的耦合相场流体动力学方程的分析，我们在这里表明，这样一个薄的接口限制也存在，如果运输包含扩散和对流。通过比较模拟研究，利用薄界面条件，与解析尖锐的界面理论，对流下的枝晶尖端生长测试这种预测。
The thin interface limit aims at minimizing the effects arising from a numerical interface thickness, inherent in diffuse interface models of solidification and microstructure evolution such as the phase field model. While the original formulation of this problem is restricted to transport by diffusion, we consider here the case of melt convection. Using an analysis of the coupled phase field-fluid dynamic equations, we show here that such a thin interface limit does also exist if transport contains both diffusion and convection. This prediction is tested by comparing simulation studies, which make use of the thin-interface condition, with an analytic sharp-interface theory for dendritic tip growth under convection.