Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
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DOI：
10.1016/j.actamat.2010.10.053
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发表时间：
2011-02-01
期刊：
影响因子：
9.4
通讯作者：
Johnson, C. M.
中科院分区：
文献类型：
--
作者：
Li, J. F.;Agyakwa, P. A.;Johnson, C. M.
将纯Sn箔夹在两片Cu箔母材之间，在260、300和340 ℃，2%H-2/98%N-2混合气体中回流5 - 480 min，观察到：（1）界面组织为Cu_6Sn_5扇形体和Cu_3Sn柱状晶;（ii）在Cu/Sn/Cu样品中，在两个原始界面处形成的Cu 6Sn 5和Cu 3Sn层的厚度的显著差异;（iii）对于一定范围的Sn夹层厚度，从Cu/Sn/Cu样品导出的Cu 6Sn 5和Cu 3Sn生长的扩散动力学常数;和（iv）一种类型的晶界/熔融通道控制生长的Cu 6Sn 5与时间的依赖性类似的体积扩散控制的生长。这些结果提供了新的洞察之间的界面反应的机制和动力学的液体Sn和固体Cu，以及其他类似的金属液/固系统。(C)2010 Acta Materialia Inc.由爱思唯尔有限公司出版。保留所有权利。
A thin interlayer of pure Sn foil has been sandwiched between two pieces of Cu foil base metal and reflowed at 260, 300 and 340 C, under 2%H-2/98%N-2 forming gas, for 5 - 480 min. We report here: (i) the interfacial microstructures to show Cu6Sn5 scallops and Cu3Sn columnar crystals; (ii) the pronounced difference in the thicknesses of the Cu6Sn5 and Cu3Sn layers formed at the two original boundary planes in the Cu/Sn/Cu samples; (iii) the diffusion-kinetic constants for the Cu6Sn5 and Cu3Sn growth derived from the Cu/Sn/Cu samples for a range of Sn interlayer thicknesses; and (iv) a type of grain boundary/molten channel-controlled growth of Cu6Sn5 with a time dependence similar to that for the volume diffusion-controlled growth. These results provide new insight into the mechanism and kinetics of the interfacial reaction between liquid Sn and solid Cu, and other similar metallic liquid/solid systems. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.