On the role of atomic oxygen in the etching of organic polymers in a radio‐frequency oxygen discharge
On the role of atomic oxygen in the etching of organic polymers in a radio‐frequency oxygen discharge
复制标题
射频氧放电中原子氧在有机聚合物蚀刻中的作用
DOI：
10.1063/1.360630
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发表时间：
1995
影响因子：
3.2
通讯作者：
R. J. Visser
中科院分区：
文献类型：
--
作者：
E. Collart;J. Baggerman;R. J. Visser
研究了低气压O2射频放电中基态原子氧的起伏动力学。用激光诱导荧光光谱监测了O的基态。放电有两种模式：连续模式和脉冲模式。典型的放电设置为射频功率为100 W，压力为10 pA，气体流量为10 sccm。用脉冲模式测量了纯O2放电中没有反应产物的O密度的行为，以及在有机聚合物刻蚀过程中的放电行为。讨论了纯氧放电中氧的产生和损失机理。对于抗蚀剂刻蚀过程中的O2放电，发现在给定的实验条件下，原子氧在所涉及的化学刻蚀机制中并不起重要作用。
The kinetics of rise and decay of ground‐state atomic oxygen was investigated in a low‐pressure O2 radio‐frequency discharge. The ground state of O was monitored using laser‐induced‐fluorescence spectroscopy. The discharge was operated in two modes: a continuous mode and a pulsed mode. Typical discharge settings are rf power of 100 W, a pressure of 10 Pa, and a gas flow of 10 sccm. Using a pulsed mode the behavior of the O density was determined in a pure O2 discharge with no reaction products, and in a discharge during etching of organic polymers. Production and loss mechanisms for O in a pure O2 discharge are discussed. For an O2 discharge during etching of resist it is found that under the given experimental conditions atomic oxygen does not play a significant role in the chemical etch mechanisms involved.