Growth of Silver Nanoparticles by DCMagnetron Sputtering
Growth of Silver Nanoparticles by DCMagnetron Sputtering
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DOI：
10.1155/2012/963609
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发表时间：
2012-01-01
影响因子：
--
通讯作者：
Limsuwan, P.
中科院分区：
文献类型：
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作者：
Asanithi, P.;Chaiyakun, S.;Limsuwan, P.
银 (Ag) 纳米粒子在许多应用中引起了极大的兴趣。然而，它们的制造受到合成方法的限制，其中尺寸、形状和聚集仍然难以控制。在这里，我们报道了使用直流 (DC) 磁控溅射在未加热的基底上生长银纳米颗粒。讨论了溅射条件对Ag纳米粒子晶粒尺寸的影响。在恒定的溅射电流和沉积时间下，对于10、15和20 cm的靶材-基底距离，Ag纳米颗粒的平均尺寸分别为5.9 +/- 1.8、5.4 +/- 1.3和3.8 +/- 0.7 nm。还报道了从纳米颗粒到蠕虫状网络的形态演变。高分辨率透射电子显微镜图像显示Ag纳米粒子的清晰晶格条纹，d间距为0.203 nm，对应于(200)平面。该技术可用于以前难以控制尺寸和尺寸均匀性的纳米颗粒的生长。
Silver (Ag) nanoparticles are of great interest for many applications. However, their fabrications have been limited by the synthesis methods in which size, shape, and aggregation are still difficult to control. Here, we reported on using direct current (DC) magnetron sputtering for growing Ag nanoparticles on unheated substrates. Effects of sputtering condition on grain size of Ag nanoparticle were discussed. At constant sputtering current and deposition time, the average sizes of Ag nanoparticles were 5.9 +/- 1.8, 5.4 +/- 1.3, and 3.8 +/- 0.7 nm for the target-substrate distances of 10, 15, and 20 cm, respectively. The morphology evolution from nanoparticles to wormlike networks was also reported. High-resolution transmission electron microscopy image represented clear lattice fringes of Ag nanoparticles with a d-spacing of 0.203 nm, corresponding to the (200) plane. The technique could be applied for growth of nanoparticles that were previously difficult to control over size and size uniformity.