A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
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DOI：
10.1016/j.ijplas.2022.103308
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发表时间：
2022-04
影响因子：
9.8
通讯作者：
Yilun Xu;J. Xian;S. Stoyanov;C. Bailey;R. Coyle;C. Gourlay;F. Dunne
中科院分区：
文献类型：
--
作者：
Yilun Xu;J. Xian;S. Stoyanov;C. Bailey;R. Coyle;C. Gourlay;F. Dunne
本文提出了一种多尺度建模方法，用于研究球栅阵列 (BGA) 板组件的单晶 Sn-3Ag-0.5Cu（wt%，SAC305）焊点在热循环下的微观结构敏感损伤的基础机制。多尺度方案将连续宏观尺度的板尺度建模和晶体微观尺度的单个焊料建模结合起来。对锡晶体取向及其在疲劳损伤中的作用的系统研究已与实验观察结果进行了比较。根据损伤发展情况检查晶体取向，为使用中的热机械疲劳提供基于证据的最佳焊料微观结构设计。
This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal cycling. The multi-scale scheme couples board-scale modelling at the continuum macro-scale and individual solder modelling at the crystal micro-scale. Systematic studies of tin crystal orientation and its role in fatigue damage have been compared to experimental observations. Crystallographic orientation is examined with respect to damage development, providing evidence-based optimal solder microstructural design for in-service thermomechanical fatigue.