Interfacial shear stress transfer at nanowire-polymer interfaces with van der Waals interactions and chemical bonding

Interfacial shear stress transfer at nanowire-polymer interfaces with van der Waals interactions and chemical bonding
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DOI:
10.1016/j.jmps.2019.03.013
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发表时间:
2019-06
影响因子:
5.3
通讯作者:
F. R. Poblete;Yong Zhu
F. R. Poblete;Yong Zhu
中科院分区:
工程技术2区
文献类型:
--
作者:
F. R. Poblete;Yong Zhu

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Interfacial mechanics between nanostructures and matrix is of critical importance for a range of device applications of the nanostructures. However, it is challenging to characterize interfacial shear stress transfer at such nanoscale interfaces. In this work, we report a new method to study the interfacial shear stress transfer of single Si nanowires on top of a polymer substrate that is subjected to uniaxial tensile loading. In-situ atomic force microscopy (AFM) testing is used to measure the nanowire deformation, more specifically, average axial strain, as a function of the applied strain to the substrate. Two types of substrates, as-prepared and chemically treated, are selected to examine the effect of van der Waals interactions and chemical bonding. It is found that nonlinear and bilinear cohesive shear-lag models can well capture the interfacial shear stress transfer characteristics associated with the two types of interactions, respectively. For each type, the interface parameters such as interfacial stiffness, shear strength, and/or fracture toughness are identified by fitting the experimental results. This work provides valuable insights into fundamental mechanisms underlying the interfacial shear-lag models. In addition, a parametric study with different nanowire dimensions is carried out, which can provide a guide to experimental design of elastic strain engineering and fracture of Si nanowires.