Highly conductive metal interconnects on three-dimensional objects fabricated with omnidirectional ink jet printing technology
Highly conductive metal interconnects on three-dimensional objects fabricated with omnidirectional ink jet printing technology
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DOI：
10.7567/jjap.56.05ea01
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发表时间：
2017-03
影响因子：
1.5
通讯作者：
Y. Yoshida;Hikaru Wada;K. Izumi;S. Tokito
中科院分区：
文献类型：
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作者：
Y. Yoshida;Hikaru Wada;K. Izumi;S. Tokito
在这项工作中，我们证明了可以使用“全向喷墨”（OIJ）印刷技术在三维物体的表面上制造高导电金属互连。 OIJ打印技术通过将6轴垂直多关节机器人的运动与精确定位和热干燥过程相结合，可以在各个方向上进行喷墨打印，从而可以进行堆叠层的打印。通过使用 OIJ 技术，我们率先成功制造出在 10 毫米长度上具有 12 mΩ 极低电阻的印刷互连层。此外，大电流测试的结果表明，印刷互连线可以承受5A的大电流30分钟或更长时间。
In this work, we demonstrate that highly conductive metal interconnects can be fabricated on the surface of three-dimensional objects using “omnidirectional ink jet” (OIJ) printing technology. OIJ printing technology makes it possible to perform ink jet printing in all directions by combining the motion of a 6-axis vertically articulated robot with precise positioning and a thermal drying process, which allows for the printing of stacked layers. By using OIJ technology, we were the first to successfully fabricate printed interconnect layers having a very low electrical resistance of 12 mΩ over a 10 mm length. Moreover, the results of the high-current test demonstrated that the printed interconnects can withstand high-current-flow of 5 A for 30 min or more.