FABRICATION OF SUBMICROMETER FEATURES ON CURVED SUBSTRATES BY MICROCONTACT PRINTING
FABRICATION OF SUBMICROMETER FEATURES ON CURVED SUBSTRATES BY MICROCONTACT PRINTING
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DOI：
10.1126/science.7624795
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发表时间：
1995-08-04
期刊：
影响因子：
56.9
通讯作者：
WHITESIDES, GM
中科院分区：
文献类型：
--
作者：
JACKMAN, RJ;WILBUR, JL;WHITESIDES, GM
微接触印刷已被用于在曲率半径小至25微米的弯曲衬底上制备具有亚微米特征的图案化自组装单分子膜(SAM)。湿法化学蚀刻使用图案化的自组装膜作为抗蚀剂，将Mu CP形成的图案转化为金色。目前，还没有类似的曲面微细加工方法。
Microcontact printing (mu CP) has been used to produce patterned self-assembled monolayers (SAMs) with submicrometer features on curved substrates with radii of curvature as small as 25 micrometers. Wet-chemical etching that uses the patterned SAMs as resists transfers the patterns formed by mu CP into gold. At present, there is no comparable method for microfabrication on curved surfaces.