Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading
Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading
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DOI：
10.1038/s43246-020-0024-3
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发表时间：
2020-05
影响因子：
7.8
通讯作者：
B. Chad Hornbuckle;C. Williams;S. W. Dean;Xuyang Zhou;C. Kale;S. Turnage;J. Clayton;G. Thompson;A. Giri;K. Solanki;K. Darling
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文献类型：
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作者：
B. Chad Hornbuckle;C. Williams;S. W. Dean;Xuyang Zhou;C. Kale;S. Turnage;J. Clayton;G. Thompson;A. Giri;K. Solanki;K. Darling
材料的微观结构通常会在冲击载荷过程中发生显着变化，当达到更高的冲击压力时会导致失效。然而，在太空旅行、核能、保护系统、极端地质事件和运输等情况下，在冲击载荷过程中保持微观结构和机械完整性至关重要。在这里，我们报告了化学优化且微观结构稳定的块体纳米晶铜钽合金的异位冲击行为，当冲击压缩至 15GPa 时，该合金显示出相对不变的微观结构或性能。不存在冲击硬化表明，构成稳定纳米晶体微观结构的晶粒和晶界充当稳定的汇，从而消除了冲击载荷期间变形引起的缺陷。这项研究有助于提高开发先进结构材料用于发生冲击载荷的极端应用的可能性。
The microstructures of materials typically undergo significant changes during shock loading, causing failure when higher shock pressures are reached. However, preservation of microstructural and mechanical integrity during shock loading are essential in situations such as space travel, nuclear energy, protection systems, extreme geological events, and transportation. Here, we report ex situ shock behavior of a chemically optimized and microstructurally stable, bulk nanocrystalline copper–tantalum alloy that shows a relatively unchanged microstructure or properties when shock compressed up to 15 GPa. The absence of shock-hardening indicates that the grains and grain boundaries that make up the stabilized nanocrystalline microstructure act as stable sinks, thereby annihilating deformation-induced defects during shock loading. This study helps to advance the possibility of developing advanced structural materials for extreme applications where shock loading occurs.