High-resolution stereolithography using a static liquid constrained interface
High-resolution stereolithography using a static liquid constrained interface
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DOI：
10.1038/s43246-021-00145-y
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发表时间：
2021-04-09
影响因子：
7.8
通讯作者：
Nishida, Toshikazu
中科院分区：
文献类型：
--
作者：
Bhanvadia, Aftab A.;Farley, Richard T.;Nishida, Toshikazu
使用常规立体光刻的3D打印是具有挑战性的，因为聚合层粘附到固体约束界面。机械分离力导致工艺可靠性差，并限制了印刷部件的几何设计空间。在这里，这些挑战通过利用树脂下方的静态惰性不混溶液体作为约束界面来克服。我们阐明的机制，使静态液体，以减轻在离散逐层和连续无层生长模式的静摩擦。惰性液体在离散生长期间用作去湿界面，并且在连续生长期间用作氧的载体以抑制聚合。这种方法能够实现广泛的工艺条件，如曝光和树脂特性，这有助于微米级分辨率和95%以上的尺寸精度。我们展示了多尺度微结构的特征尺寸范围从16 μ m到数千微米和功能器件的纵横比大于50：1，而不使用牺牲支持。该工艺可实现多种应用的功能器件的3D微制造。在立体光刻过程中，聚合层与约束固体界面之间的粘附限制了分辨率。在这里，静态惰性液体被用作约束界面以减轻静摩擦，使得能够制造具有跨越数万微米至数千微米的特征尺寸的高分辨率部件。
3D printing using conventional stereolithography is challenging because the polymerized layers adhere to the solid constraining interface. The mechanical separation forces lead to poor process reliability and limit the geometrical design space of the printed parts. Here, these challenges are overcome by utilizing a static inert immiscible liquid below the resin as the constraining interface. We elucidate the mechanisms that enable the static liquid to mitigate stiction in both discrete layer-by-layer and continuous layerless growth modes. The inert liquid functions as a dewetting interface during the discrete growth and as a carrier of oxygen to inhibit polymerization during the continuous growth. This method enables a wide range of process conditions, such as exposure and resin properties, which facilitates micrometer scale resolutions and dimensional accuracies above 95%. We demonstrate multi-scale microstructures with feature sizes ranging from 16 mu m to thousands of micrometers and functional devices with aspect ratios greater than 50:1 without using sacrificial supports. This process can enable additive 3D microfabrication of functional devices for a variety of applications.Stiction between polymerized layers and the constraining solid interface during stereolithography limits resolution. Here, a static inert liquid is used as a constraining interface to mitigate stiction, enabling high resolution parts to be fabricated with feature sizes spanning tens to thousands of microns.