C-Au Covalently Bonded Molecular Junctions Using Nonprotected Alkynyl Anchoring Groups
C-Au Covalently Bonded Molecular Junctions Using Nonprotected Alkynyl Anchoring Groups
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DOI：
10.1021/jacs.6b03383
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发表时间：
2016-07-13
影响因子：
15
通讯作者：
van der Zant, Herre S. J.
中科院分区：
文献类型：
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作者：
Olavarria-Contreras, Ignacio Jose;Perrin, Mickael L.;van der Zant, Herre S. J.
我们报道了一种实现碳金（C-Au）键合分子连接的方法，而不需要添加剂来解除烷基碳作为末端锚基的保护。利用机械控制断结（MCBJ）技术，我们确定了在环境条件下通过这种炔基部分连接到金电极上的炔基端接寡苯（OPA(n)）家族的最可能电导值。分子通过两边的sp杂化碳原子与金导线结合。将我们的结果与其他存在有机金属C-Au键的分子家族进行比较，我们得出结论，由于导电轨道与金引线的耦合存在强烈差异，通过sp杂化碳原子接触的分子的电导低于使用spa杂化的分子。
We report on an approach to realize carbon-gold (C-Au) bonded molecular junctions without the need for an additive to deprotect the alkynyl carbon as endstanding anchor group. Using the mechanically controlled break junction (MCBJ) technique, we determine the most probable conductance value of a family of alkynyl terminated oligophenylenes (OPA(n)) connected to gold electrodes through such an akynyl moiety in ambient conditions. The molecules bind to the gold leads through an sp-hybridized carbon atom at each side. Comparing our results with other families of molecules that present organometallic C-Au bonds, we conclude that the conductance of molecules contacted via an sp-hybridized carbon atom is lower than the ones using spa hybridization due to strong differences in the coupling of the conducting orbitals with the gold leads.