X-Ray Stress Measurement Using Whole Back Diffraction Ring
X-Ray Stress Measurement Using Whole Back Diffraction Ring
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DOI：
10.4028/www.scientific.net/msf.490-491.137
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发表时间：
2005-04
期刊：
影响因子：
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通讯作者：
S. Ohya;K. Akita;Yuichi Shitaba;Mitsutoshi Yoshikawa
中科院分区：
文献类型：
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作者：
S. Ohya;K. Akita;Yuichi Shitaba;Mitsutoshi Yoshikawa
本研究的目的是发展一种新的应力测量方法，使用一次X射线曝光获得的整个衍射环。本文提出了一种确定平面应力分量σx、σy和τxy的新原理。随后，开发了基于新方法的应力分析仪。证实了应力测量的准确性。结果表明，该分析仪能够以足够的精度测量σx和τxy。实践证明，若能提高σy的精度，该方法可为材料科学研究和现场应用提供充分的依据。
The purpose of this study is to develop the new stress measurement using a whole diffraction ring obtained at the single X-ray exposure. In this paper, a new principle to determine the plane stress components, i.e. σx, σy and τxy, was proposed. Subsequently, a stress analyzer based on the new method was developed. The accuracy of stresses measured was confirmed. As the result, it was clarified that this analyzer enables to measure σx and τxy with sufficient accuracy. It was confirmed that this method can sufficiently contribute to study on material science and to be applicable in field work if an accuracy of σy is improved.