Viscoelastic behavior of polishing pad: Effects on edge roll-off during silicon wafer polishing
Viscoelastic behavior of polishing pad: Effects on edge roll-off during silicon wafer polishing
复制标题
抛光垫的粘弹性行为：对硅片抛光过程中边缘滚落的影响
DOI：
10.1016/j.precisioneng.2019.11.005
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发表时间：
2020
期刊：
影响因子：
--
通讯作者：
Enomoto Toshiyuki
中科院分区：
文献类型：
--
作者：
Satake Urara;Harada Sena;Enomoto Toshiyuki
在半导体器件制造中，硅片的表面平整度对芯片成品率有重要影响。因此，有一个强烈的需求，以防止在抛光过程中，由于边缘滚落，在晶圆片边缘附近的表面平整度恶化。在本研究中，我们研究了抛光垫的粘弹性行为及其对晶圆边缘附近材料去除分布均匀性的影响。在此基础上，我们提出了改善晶圆边缘表面平整度所需的抛光条件。利用硅片进行的双面抛光实验表明，所提出的抛光条件有效地减少了边缘滚落。
In semiconductor device fabrication, surface flatness of silicon wafers has a significant impact on the chip yield. Hence, there is a strong demand to prevent the deterioration in surface flatness near the wafer edge due to edge roll-off during polishing. In the present study, we investigate the viscoelastic behavior of polishing pads and its effects on the uniformity of material removal distribution near the wafer edge. On the basis of the findings, we propose polishing conditions required to improve surface flatness near the wafer edge. The double-sided polishing experiments performed using silicon wafers reveal that the proposed polishing conditions effectively reduce edge roll-off.