Capacitor‐Discharge Joining of Oxide Ceramics
Capacitor‐Discharge Joining of Oxide Ceramics
复制标题
氧化物陶瓷的电容器放电接合
DOI：
10.1111/j.1151-2916.1999.tb01902.x
复制
发表时间：
2004
影响因子：
3.9
通讯作者：
E. Wallach
中科院分区：
文献类型：
--
作者：
S. Turan;I. Bucklow;E. Wallach
电容-放电连接技术已被用于制造氧化铝-金属-氧化铝和氧化锆-金属-氧化锆连接使用薄箔的铝，钛，或非晶Alx Niy Yz合金作为中间层。该技术包括将高能脉冲通过导电中间层，从而将中间层转化为液体-蒸汽“带电箔”，使连接的陶瓷片湿润并粘合在一起。通过剪切试验测定了接头的结合强度，结果表明，采用非晶Alx Niy Yz夹层时，氧化铝和氧化锆衬底的结合强度最高。对接头界面结构的研究表明，在陶瓷基体晶粒和非晶Alx Niy Yz中间层之间存在明显的反应层。
A capacitor-discharge joining technique has been used to fabricate alumina–metal–alumina and zirconia–metal– zirconia joints using thin foils of aluminum, titanium, or amorphous Alx Niy Yz alloys as interlayers. The technique involves passing a high-energy pulse through a conductive interlayer, so converting the interlayer into a liquid-vapor “energized foil” which wets and bonds the pieces of ceramic being joined. The bond strengths of the joints were mea-sured by shear testing which showed that the highest bond strengths for both alumina and zirconia substrates were obtained when an amorphous Alx Niy Yz interlayer was used. An investigation of the interfacial structure of the joints revealed that there is a distinct reaction layer between the ceramic substrate grains and the amorphous Alx Niy Yz interlayer.