Effect of Post-Treatments on Atomic Layer Deposition of TiN Thin Films Using Tetrakis(dimethylamido)titanium and Ammonia
Effect of Post-Treatments on Atomic Layer Deposition of TiN Thin Films Using Tetrakis(dimethylamido)titanium and Ammonia
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后处理对四(二甲基氨基)钛和氨原子层沉积 TiN 薄膜的影响
DOI:
10.1143/jjap.41.l418
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发表时间:
2002
期刊:
影响因子:
--
通讯作者:
Choon
中科院分区:
文献类型:
--
作者:
J. Yun;E. Choi;C. Jang;Choon
The atomic layer deposition (ALD) of titanium nitride (TiN) thin films from tetrakis(dimethylamido)titanium (TDMAT) and ammonia (NH3) has been investigated, and the properties of ALD TiN films with and without post-treatments such as rapid thermal nitridation (RTN) and H2/N2 plasma treatment were evaluated and compared with those of metal organic chemical vapor deposition (MOCVD) TiN with and without RTN. Based on the saturation of the deposition rate as a function of TDMAT pulse time, the linear relationship between film thickness and the number of cycles, and the perfect step coverage, the success of the ALD process for TDMAT and NH3 was confirmed. For the ALD TiN film, an aging effect was observed and the carbon in the film was removed by RTN. Also, by plasma treatment, carbon and oxygen removal and surface nitridation were accomplished leading to the prevention of the aging effect, lower resistivity, and slight crystallinity. The cracks and voids were found on the ALD TiN film surface treated by RTN at 700°C substrate temperature, however, they were not found for MOCVD TiN film.