Crumpling of Microstrip Antenna Array
Crumpling of Microstrip Antenna Array
复制标题
DOI：
10.1109/tap.2013.2269133
复制
发表时间：
2013-06
影响因子：
5.7
通讯作者：
Q. Bai;J. Rigelsford;R. Langley
中科院分区：
文献类型：
--
作者：
Q. Bai;J. Rigelsford;R. Langley
研究了一种2 × 2微带贴片天线阵在折皱条件下的性能。天线阵列是在纺织材料上制造的，并且讨论了类似于真实的应用的三种起皱情况。各个贴片元件的性能与阵列的整体性能相关。频率偏移高达6%的测量时，皱皱巴巴的阵列，boconut增益降低了高达6 dB的方向性和效率的显着变化，高达20%。织物阵列的总效率在一个平面中的起皱增加，但在另一个平面中福尔斯下降。
The performance of a 2 × 2 microstrip patch array under crumpling conditions is presented. The antenna array was manufactured on textile material, and three cases of crumpling resembling real applications are discussed. The performance of the individual patch elements correlate with the overall performance of the array. Frequency shifts of up to 6% are measured for the array when crumpled, the boresight gain is reduced by up to 6 dB with significant changes in directivity and efficiency, up to 20%. The overall efficiency for the textile array increases for crumpling in one plane but falls in the other.