Improved creep resistance of Al-Cu alloy matrix composite reinforced with bimodal-sized TiCp
Improved creep resistance of Al-Cu alloy matrix composite reinforced with bimodal-sized TiCp
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双峰尺寸 TiCp 增强 Al-Cu 合金基复合材料的抗蠕变性能提高
DOI：
10.1016/j.msea.2017.12.071
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发表时间：
2018-01-24
期刊：
影响因子：
6.4
通讯作者：
Jiang, Qi-Chuan
中科院分区：
文献类型：
--
作者：
Tian, Wei-Si;Zhao, Qing-Long;Jiang, Qi-Chuan
双峰尺寸（微米+纳米）TiCp/Al-Cu复合材料的抗蠕变性能分别是Al-Cu基体合金和单峰尺寸复合材料的10-38倍和3-6倍，这主要归因于纳米TiCp的强化作用和大量细小θ '相的析出。
The creep resistance of the bimodal-sized (micron + nano) TiCp/Al-Cu composite was 10-38 times and 3-6 times higher than that of the Al-Cu matrix alloy and monomodal-sized composites, respectively, attributed to strengthening effects of nano-TiCp and larger number of finer theta' precipitates.