Guided wave interaction with hole damage using the local interaction simulation approach
Guided wave interaction with hole damage using the local interaction simulation approach
复制标题
使用局部相互作用模拟方法引导波与孔损伤的相互作用
DOI：
10.1088/0964-1726/23/12/125010
复制
发表时间：
2014
影响因子：
4.1
通讯作者：
Carlos E S Cesnik
中科院分区：
文献类型：
--
作者：
Matthew B. Obenchain;Carlos E S Cesnik
本文采用局部相互作用模拟方法和实验方法研究了孔损伤对各向同性和复合材料板中导波传播的影响。利用最近开发的LISA混合方法对压电陶瓷晶圆的导波产生进行了建模。首先，模拟了各向同性板上的孔，以建立LISA捕捉不同孔尺寸导波散射效应的能力。实验结果与模拟结果进行了比较，以帮助评估LISA模型。其次，建立了复合材料层合板的孔损伤模型，并对实验结果进行了比较。模拟了不同的孔尺寸和方位位置，以确定改变这些参数的影响。各向同性和复合损伤研究的结果清楚地表明，LISA能够模拟孔洞损伤。仿真和实验结果都说明了不同传感器位置相对于致动器和损伤位置的优缺点。最后，研究表明LISA模型能够捕获由部分厚度孔引起的模式转换。
This paper considers the effects of hole damage on guided wave propagation in isotropic and composite plates using both the local interaction simulation approach (LISA) and experimental methods. Guided wave generation from piezoceramic wafers is modeled using the recently developed LISA hybrid approach. First, holes in isotropic plates are simulated to establish LISAʼs ability to capture the guided wave scattering effects of various hole sizes. Experimental results are compared with the simulations to aid in evaluating the LISA model. Next, hole damage in cross-ply composite laminates is modeled and compared with experimental results. Various hole sizes and azimuthal locations are simulated to determine the effects of varying those parameters. Results from both the isotropic and composite damage studies clearly display the ability of LISA to model hole damage. Both the simulation and experimental results illustrate the advantages and disadvantages of various sensor locations relative to the actuator and damage locations. Finally, the study shows the ability of the LISA model to capture mode conversions resulting from partial thickness holes.