Synthesis of alkali-soluble silicone resin suitable for resist material in microlithography
Synthesis of alkali-soluble silicone resin suitable for resist material in microlithography
复制标题
适用于微光刻抗蚀剂材料的碱溶性有机硅树脂的合成
DOI：
10.1016/0032-3861(90)90403-l
复制
发表时间：
1990
期刊：
影响因子：
4.6
通讯作者：
S. Imamura
中科院分区：
文献类型：
--
作者：
H. Ban;A. Tanaka;Y. Kawai;S. Imamura
以苯基硅氧烷低聚物为原料，采用Friedel Crafts乙酰化法合成了一种碱溶性硅树脂乙酰化苯基硅氧烷低聚物（APSQ）。通过这种乙酰化，在APSQ中同时形成硅烷醇基团。硅烷醇基团的存在使得APSQ可溶于碱性水溶液。制备了由APSQ和敏化剂组成的硅基产物，用于紫外、深紫外、电子束和x射线光刻。这些基于APSQ的抗蚀剂可以在碱性水溶液中制备，并且具有较高的抗氧反应离子腐蚀性能。
An alkali-soluble silicone resin, acetylated phenylsilsesquioxane oligomer (APSQ), was synthesized from phenylsilsesquioxane oligomer by Friedel Crafts acetylation. Silanol groups are simultaneously formed in APSQ through this acetylation. The presence of silanol groups makes APSQ soluble in alkaline aqueous solutions. Silicone-based results composed of APSQ and sensitizers were prepared for ultraviolet (u.v.), deep u.v., electron beam and X-ray lithographies. These resists based on APSQ can be developed with alkaline aqueous solutions and have high resistance to oxygen reactive ion etching.