High performance thermal vias in LTCC substrates
High performance thermal vias in LTCC substrates
复制标题
LTCC 基板中的高性能散热孔
DOI：
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发表时间：
2002
期刊：
影响因子：
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通讯作者：
W. Jones
中科院分区：
文献类型：
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作者：
M. Zampino;R. Kandukuri;W. Jones
设备功率密度的增加对系统级热管理提出了更高的要求。低温共烧陶瓷 (LTCC) 的新发展使得能够制造高导热率通孔阵列。新材料，包括卸载通孔油墨和共烧银带，可以开发有效导热率超过 250 W/m/spl deg/K 的热通孔结构。为了准确预测热性能，必须知道导热系数的值。已通过闪蒸扩散率测量了多种市售 LTCC 陶瓷和通孔填充材料的热导率，其中通孔材料接近 300 W/m/spl deg/K。
Increased power densities in devices are placing greater demands in system level thermal management. New developments in low temperature cofire ceramic (LTCC) have allowed the fabrication of high thermal conductivity via arrays. New materials, including unloaded via inks and cofire Ag tape, allow the development of thermal via structure with effective thermal conductivities exceeding 250 W/m/spl deg/K. To accurately predict the thermal performance, the value of thermal conductivity must be known. Thermal conductivity has been measured by flash diffusivity for a number of commercially available LTCC ceramics and via fill materials, with the via materials approaching 300 W/m/spl deg/K.