Comparison of the thermal stability between electro-deposited and cold-rolled nanocrystalline copper samples

Comparison of the thermal stability between electro-deposited and cold-rolled nanocrystalline copper samples
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DOI:
10.1016/s0921-5093(00)00712-7
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发表时间:
2000-06
影响因子:
6.4
通讯作者:
Lei Lu;Lujie Wang;B. Ding;K. Lu
Lei Lu;Lujie Wang;B. Ding;K. Lu
中科院分区:
材料科学1区
文献类型:
--
作者:
Lei Lu;Lujie Wang;B. Ding;K. Lu

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