A forward closed-loop virtual simulation system for milling process considering dynamics processing-machine interactions

A forward closed-loop virtual simulation system for milling process considering dynamics processing-machine interactions
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DOI:
10.1007/s00170-019-04057-7
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发表时间:
2019-07
期刊:
The International Journal of Advanced Manufacturing Technology
影响因子:
--
通讯作者:
Wanqun Chen;Z. Tong;D. Huo;Wenbin Zhong;X. Jiang
Wanqun Chen;Z. Tong;D. Huo;Wenbin Zhong;X. Jiang
中科院分区:
其他
文献类型:
--
作者:
Wanqun Chen;Z. Tong;D. Huo;Wenbin Zhong;X. Jiang

文献摘要

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在本文中,一个闭环虚拟仿真系统已经开发,以模拟铣削过程中考虑到制造过程和机床动力学之间的相互作用。该系统由切削力模块、加工稳定性模块和曲面生成模块组成。该模型考虑了加工参数、刀具几何参数和机床系统动态性能的同步影响,并将机床运动误差作为反馈进行补偿,以修正刀具轨迹。利用瞬时刀具-工件接触状态计算切削力,利用切削力峰峰值图预测不同切削深度和切削速度下的时域加工稳定性。利用刀具的包络曲线重构已加工表面纹理。此外,为了验证所提出的系统的可行性,进行了微铣削实验,结果表明,仿真系统能够有效地预测微铣削过程,如切削力和加工表面质量。该方法在工艺参数优化和表面形貌预测等方面具有潜在的应用价值。
In this paper, a closed-loop virtual simulation system has been developed to simulate the milling process considering the interactions between manufacturing processes and machine tool dynamics. The system consists of cutting force module, machining stability module, and surface generation module. The synchronous effects of the machining parameters, tool geometry parameters, and the dynamic performance of the machine tool system are considered in the model, and the instant machine dynamic motion error is compensated in the model as a feedback to correct the cutter trajectories. Instantaneous tool-workpiece contact status is used to calculate cutting force, and the peak-to-peak cutting force plot is used to predict the machining stability in time domain under different depths of cut and cutting speeds. The envelope curve of the cutting tool is used to reconstruct the machined surface texture. Moreover, to verify the feasibility of the proposed system, micro-milling experiments are conducted with results showing that the simulation system enables the effective prediction of micro-milling process such as the cutting forces and machined surface quality. It can be potentially applied in production on processing parameter optimization and surface topography prediction.