Relationship between dielectric strength and mechanical properties of alumina films fabricated by aerosol deposition
Relationship between dielectric strength and mechanical properties of alumina films fabricated by aerosol deposition
复制标题
DOI：
10.1016/j.ceramint.2022.02.008
复制
发表时间：
2022-02
影响因子：
5.2
通讯作者：
Y. Matsubayashi;H. Tsuda;T. Nagoshi;J. Akedo
中科院分区：
文献类型：
--
作者：
Y. Matsubayashi;H. Tsuda;T. Nagoshi;J. Akedo
气溶胶沉积（AD）是一种很有前途的制备绝缘涂层的技术，因为它允许在室温下制备具有微米厚度的致密膜。然而，AD法制备的薄膜是由纳米尺度的微小晶粒组成的，含有许多晶界，其绝缘性能尚不清楚。在这项研究中，介电强度，纳米压痕硬度，和残余应力的氧化铝薄膜制备的AD进行了研究。实现了高达200 kV mm− 1的介电强度，与其他涂层技术相比，这相当于在1-100 μm厚度范围内的优异性能。介电强度随硬度和残余压应力的增加而增加，这与晶粒尺寸和晶界密度有关。
Aerosol deposition (AD) is a promising technique for preparing insulation coatings because it allows for the room-temperature fabrication of dense films with micrometer thickness. However, films fabricated by AD are composed of tiny crystallites on the nanometer scale and contain many grain boundaries, and their insulating performance is not clear. In this study, the dielectric strength, nanoindentation hardness, and residual stress of alumina films fabricated by AD were investigated. Dielectric strengths as high as 200 kV mm−1were achieved, which corresponds to excellent performance in the thickness range of 1–100 μm compared to other coating techniques. The dielectric strength tended to increase with increasing hardness and compressive residual stress, which was rationalized in terms of the grain size and grain boundary density.