Effect of Additives in the Electrolyte on the Physical Properties of Electrodeposited Copper
Effect of Additives in the Electrolyte on the Physical Properties of Electrodeposited Copper
复制标题
电解液中添加剂对电解铜物理性能的影响
DOI：
10.5104/jiepeng.2.55
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发表时间：
2009
期刊：
影响因子：
--
通讯作者：
M. Dobashi
中科院分区：
文献类型：
--
作者：
Mitsuyoshi Matsuda;Takuya Takahashi;S. Yoshihara;M. Dobashi
使用镀液添加剂(如二(3-磺丙基)二硫化物(SPS)等光亮剂)沉积的铜即使在室温下也会显示物理性能的变化。本研究对2-巯基-5-苯并咪唑(2M-5S)中具有防止性质变化的元素或基团进行了研究。因此，硫基和氮原子被认为是必需的，苯环被认为有助于这些作用。2M-5S被认为利用δ极化的氮原子与铜(I)络合物和共存的添加剂产生强烈的结合，并在还原时增加了沉积中的杂质含量。
Copper deposited using bath additives added to the bath such as brighteners like Bis-(3-sulfopropyl)-disulfide (SPS) shows physical property changes when kept even at room temperature. In this research, the elements or groups contained in 2-Mercapto-5-benzimidazole (2M-5S), which have effects in preventing the property changes, are investigated. From this, Mercapto groups and Nitrogen atoms are thought to be essential and Benzene rings are thought to assist these effects. 2M-5S is thought to produce a strong union with the Cu(I) complex and coexisting additives using δ -polarized Nitrogen atoms and increases the amount of impurities incorporated into the deposits at the time of reduction.