Splatting and Solidification Behavior of Plasma Sprayed Metallic Powders Impinging on Flat SUS304 Substrate
Splatting and Solidification Behavior of Plasma Sprayed Metallic Powders Impinging on Flat SUS304 Substrate
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等离子喷涂金属粉末撞击平面SUS304基材的飞溅和凝固行为
DOI：
10.2320/jinstmet1952.59.11_1178
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发表时间：
1995
影响因子：
--
通讯作者：
Yahui Huang
中科院分区：
文献类型：
--
作者：
M. Fukumoto;S. Kato;Motoyoshi Ohwatari;Yahui Huang
of both substrate tempera加re and particle on the splat behavior of the plasma sprayed powders impinging on the flat SUS304 steel substrate to the relation between solidification rate and sur− face tension of the powder materia1． （5） As for the intervals between solidification and flattenning， it seems that both occur simultaneously when the solidification tends to occur easier， while the flattenning occurs preferentially followed by the solidification when the solidification rate is lower．