Experimental identification of thermal induced warpage in polymer-metal composite films
Experimental identification of thermal induced warpage in polymer-metal composite films
复制标题
聚合物-金属复合薄膜热致翘曲的实验识别
DOI：
10.1016/j.microrel.2016.03.023
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发表时间：
2016-07-01
影响因子：
1.6
通讯作者：
Luo, Le
中科院分区：
文献类型：
--
作者：
Li, Heng;Zhu, Chunsheng;Luo, Le
由多层聚合物和金属组成的复合厚膜广泛应用于集成电路(IC)及其封装中，由于复杂的内部应力分布和演化，产生了复杂的应力和翘曲问题。利用多光束激光光学传感器(MOS)系统对多层聚酰亚胺(PI)/铜复合薄膜的晶片翘曲产生和演化过程进行了原位测量。研究发现，PI对粘弹性和玻璃化转变引起的晶圆翘曲演化和铜的塑性变形有复杂的影响，并且这种影响在不同的组织和不同的温度下是不同的。复合材料的曲率-温度曲线在远低于单一PI或Cu薄膜的温度下出现非线性，表现出PI和Cu的交互作用。与在高温下完全应力松弛的裸膜或封顶膜不同，涂覆铜膜的底部聚酰亚胺具有中等的压应力，表明铜包覆膜抑制了聚酰亚胺的应力松弛。加热过程中的翘曲演化与冷却过程中的翘曲演化不同，可能是由于变形机制不同所致。(C)2016爱思唯尔有限公司。保留所有权利。
Composite thick films consisting of multi-layered polymers and metals are widely used in integrated circuits(IC) and its packaging, and it arises intricate stress and warpage problems due to complex inner stress distribution and evolution. The wafer warpage origination and evolution of multi-layered polyimide (PI)/Cu composite film is measured in-situ by a Multi-beam Laser Optical Sensor (MOS) system. It's found that PI has an intricate influence on wafer warpage evolution and Cu plastic deformation due to viscoelasticity and glass-transition, and the influence differs in different structures and at different temperatures. Nonlinearity of the curvature-temperature curve of the composite occurs at much lower temperature than in single PI or Cu film, showing mutual effect of PI and Cu. Unlike bare or capping PI film that totally stress relaxed at high temperature, bottom PI coated by Cu film sustains a medium compressive stress, indicating that Cu coating film has restrained stress relaxation of PI. The warpage evolution during heating is different from that during cooling, perhaps due to different deformation mechanism. (C) 2016 Elsevier Ltd. All rights reserved.