On the Resistance Increase of Gold‐aluminium Wire Bonds
On the Resistance Increase of Gold‐aluminium Wire Bonds
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金铝键合电阻增阻研究
DOI：
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发表时间：
1991
期刊：
影响因子：
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通讯作者：
J. Haag
中科院分区：
文献类型：
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作者：
J. Haag
研究了来自三个不同制造商的五种不同金厚膜油墨上的铝引线键合（Al‐1%Si引线，直径25 µm）的老化行为。提出了一种新的机制，金-铝金属间化合物的氧化，来解释该系统的接触电阻的退化。用这个理论可以解释键电阻的退化以及“愈合效应”。氧化可以通过在真空中老化来证明。表面分析方法表明，化合物Au 4Al负责的氧化。
The ageing behaviour of aluminium wire bonds (Al‐1%Si wire, 25 µm diameter) on five different gold thick film inks from three different manufacturers has been investigated. A new mechanism, the oxidation of the gold‐aluminium intermetallics, is proposed to explain the degradation of contact resistance for this system. With this theory the degradation of bond resistance, as well as the ‘healing effect’, can be explained. The oxidation can be proven by ageing in a vacuum. Surface analytical methods have shown the compound Au4Al to be responsible for the oxidation.