Assessment of New Relation for the Elastic Compliance of a Film-Substrate System
Assessment of New Relation for the Elastic Compliance of a Film-Substrate System
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薄膜-基材系统弹性柔量新关系式的评估
DOI：
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发表时间：
2001
期刊：
影响因子：
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通讯作者：
G. Pharr
中科院分区：
文献类型：
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作者：
A. Rar;H. Song;G. Pharr
本文提出了一种新的薄膜-基底系统弹性柔度的闭合关系式。该关系式是Gao等人[1]工作的延伸。修改后的关系式增加了薄膜和衬底之间模量失配的适用范围。的关系的准确性进行评估，通过比较有限元模拟，其他近似的数值解，和纳米压痕实验上进行的氟化硅酸盐玻璃（FSG）膜上的硅基板。的关系的好处和局限性进行了讨论。
A new closed-form relation for the elastic compliance of a film-substrate system indented by a flat cylindrical punch is presented. The relation is an extension of the work of Gao at al. [1] modified to increase the applicable range of modulus mismatch between the film and substrate. The accuracy of the relation is assessed by comparison to finite element simulations, other approximate numerical solutions, and nanoindentation experiments performed on a fluorinated silicate glass (FSG) film on a silicon substrate. The benefits and limitations of the relation are discussed.