Influence of Pulse Reverse Plating on the Properties of Ni-Fe Thin Films

Influence of Pulse Reverse Plating on the Properties of Ni-Fe Thin Films
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DOI:
10.1109/tmag.2009.2036723
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发表时间:
2010-04-01
影响因子:
2.1
通讯作者:
Desmulliez, Marc P. Y.
Desmulliez, Marc P. Y.
中科院分区:
工程技术4区
文献类型:
--
作者:
Flynn, David;Desmulliez, Marc P. Y.

文献摘要

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通过脉冲反向 (PR) 电沉积沉积的 NiFe 薄膜是用于高开关频率磁性元件的下一代磁芯磁性材料的有前途的候选材料。通过实验设计 (DOE) 评估 PR 电镀对 NiFe 的结构、磁和电性能的影响。将结果与通过相同电解液直流 (dc) 沉积生产的 NiFe 合金进行比较。与直流样品相比,PR 样品的电阻率和相对磁导率分别增加了 2 倍和 1.5 倍。 PR样品的矫顽力和饱和磁通密度分别降低了37%和5%。
NiFe thin films deposited by pulse reverse (PR) electrodeposition are promising candidates for the next generation of core magnetic material to be used in magnetic components operating at high switching frequency. The influence of PR electroplating on the structural, magnetic and electrical properties of NiFe is assessed by means of a design of experiment (DOE). Results are compared to NiFe alloys produced by direct current (dc) deposition from an identical electrolyte. The PR samples exhibit an increase in resistivity and relative permeability by a factor of 2 and 1.5, respectively, in comparison to the dc samples. The coercivity and saturation flux density of the PR samples are reduced by 37% and 5%, respectively.