Recrystallization of pure copper investigated by calorimetry and microhardness

Recrystallization of pure copper investigated by calorimetry and microhardness
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DOI:
10.1016/j.matchar.2008.01.002
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发表时间:
2008-10-01
影响因子:
4.7
通讯作者:
Gloriant, T.
Gloriant, T.
中科院分区:
材料科学1区
文献类型:
--
作者:
Benchabane, G.;Boumerzoug, Z.;Gloriant, T.

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