Thermal Sensitive Shape Memory Behavior of Epoxy Composites Reinforced with Silicon Carbide Whiskers
Thermal Sensitive Shape Memory Behavior of Epoxy Composites Reinforced with Silicon Carbide Whiskers
复制标题
碳化硅晶须增强环氧树脂复合材料的热敏形状记忆行为
DOI：
10.3390/app7010108
复制
发表时间：
2017
影响因子：
2.7
通讯作者：
Ye Junjie
中科院分区：
文献类型：
--
作者：
Wang Yongkun;Tian Wenchao;Liu Xiaohan;Ye Junjie
通过在形状记忆环氧树脂中引入不同量的碳化硅晶须，制备了一种新型形状记忆聚合物复合材料。通过动态力学分析、扫描电子显微镜和弯曲试验研究了系统的热机械性能和结构变化之间的关系。结果表明，当SiCw含量达到12wt%时，复合材料的弯曲强度可提高64.1%。SiCw/环氧复合材料的形状转变温度随SiCw含量的增加略有下降，但所有复合材料均表现出优异的形状记忆性能。形状固定率随SiCw含量的增加而增加（>99%），形状回复率随SiCw含量的增加而略有下降（>95%）。所有的复合材料几乎恢复到其原始形状在2分钟内（不是100%），形状恢复速度显着提高在较高的温度。预计标记产品将用于航空航天工业。
A novel shape memory polymer composite was fabricated by introducing various amounts of silicon carbide whiskers (SiCws) into a shape memory epoxy. The relationship between the thermomechanical properties of the system and structural changes were investigated via dynamic mechanical analysis, scanning electron microscopy, and bending tests. The results show that the bend strength of composites can improve by 64.1% when SiCw content reaches 12 wt %. The shape transition temperatures of SiCw/epoxy composites decreased slightly with the increase in SiCw content, but it was noted that all of the composites showed excellent shape memory properties. The shape fixity ratio increased as SiCw content increased (>99%), and the shape recovery ratio slightly decreased as SiCw content increased (>95%). All of the composites nearly recovered to their original shape within 2 min (not 100%), and the shape recovery speed significantly improved at a higher temperature. It is anticipated that tagging products will be used in the aerospace industry.