Scaling of GaN HEMTs and Schottky Diodes for Submillimeter-Wave MMIC Applications
Scaling of GaN HEMTs and Schottky Diodes for Submillimeter-Wave MMIC Applications
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DOI:
10.1109/ted.2013.2268160
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发表时间:
2013-10-01
影响因子:
3.1
通讯作者:
Micovic, Miroslav
中科院分区:
文献类型:
--
作者:
Shinohara, Keisuke;Regan, Dean C.;Micovic, Miroslav
In this paper, we report state-of-the-art high frequency performance of GaN-based high electron mobility transistors (HEMTs) and Schottky diodes achieved through innovative device scaling technologies such as vertically scaled enhancement and depletion mode (E/D mode) AlN/GaN/AlGaN double-heterojunction HEMT epitaxial structures, a low-resistance n(+)-GaN/2DEG ohmic contact regrown by MBE, a manufacturable 20-nm symmetric and asymmetric self-aligned-gate process, and a lateral metal/2DEG Schottky contact. As a result of proportional scaling of intrinsic and parasitic delays, an ultrahigh f(T) exceeding 450 GHz (with a simultaneous f(max) of 440 GHz) and a f(max) close to 600 GHz (with a simultaneous f(T) of 310 GHz) are obtained in deeply scaled GaN HEMTs while maintaining superior Johnson figure of merit. Because of their extremely low on-resistance and high gain at low drain voltages, the devices exhibited excellent noise performance at low power. 501-stage direct-coupled field-effect transistor logic ring oscillator circuits are successfully fabricated with high yield and high uniformity, demonstrating the feasibility of GaN-based E/D-mode integrated circuits with >1000 transistors. Furthermore, self-aligned GaN Schottky diodes with a lateral metal/2DEG Schottky contact and a 2DEG/n(+)-GaN ohmic contact exhibited RC-limited cutoff frequencies of up to 2.0 THz.