Electromigration Study of Plasma Etched Copper Lines with Copper Oxide Capping Layers
Electromigration Study of Plasma Etched Copper Lines with Copper Oxide Capping Layers
复制标题
具有氧化铜覆盖层的等离子蚀刻铜线的电迁移研究
DOI：
10.1149/09703.0051ecst
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发表时间：
2020
期刊：
影响因子：
--
通讯作者：
Kuo, Yue
中科院分区：
文献类型：
--
作者：
Su, Jia Quan;Kuo, Yue
本文研究了等离子体刻蚀铜导线时，铜氧化物覆盖层的电迁移失效现象。通过氧等离子体氧化方法制备的氧化铜覆盖整个铜叠层。这种结构的破坏是由电阻随应力时间的变化来确定的。因此，假设绝热条件，即焦耳热耗散到玻璃基板和环境中可以忽略不计，计算线温度。线的表面颜色随着应力时间的变化而变化。的氧化铜钝化层的组成和颜色的特征和相关的焦耳加热。颜色变化可以作为预测线路故障位置和时间的有效参考。综上所述，氧化铜钝化层可以容易地形成为自对准结构，并且可以从颜色变化检测线路故障过程。
The electromigration failure phenomena of the plasma etched copper line with a copper oxide capping layer has been studied. The copper oxide prepared by the oxygen plasma oxidation method covers the entire copper stack. The failure of this kind of structure was determined from the resistance change with the stress time. The line temperature was calculated accordingly assuming the adiabatic condition, ie, the dissipation of Joule heat to the glass substrate and environment was negligible. The surface color of the line changes with the stress time. The composition and color of the copper oxide passivation layer were characterized and correlated to the Joule heating. The color change can be an effective reference to predict the line failure location and time. In summary, the copper oxide passivation layer can be easily formed into the self-aligned structure and the line failure process can be detected from the color change.