Direct method for determining the segregation in silver-copper solid solutions not prone to brittle breakage of grain boundaries
Direct method for determining the segregation in silver-copper solid solutions not prone to brittle breakage of grain boundaries
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测定不易发生晶界脆性破坏的银铜固溶体偏析的直接方法
DOI：
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发表时间：
2011
期刊：
影响因子：
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通讯作者：
D. Podgornyi
中科院分区：
文献类型：
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作者：
S. Zhevnenko;D. V. Vaganov;D. Podgornyi
提出了一种测量不易出现晶界脆化的铜基合金中晶界（GB）化学成分的新方法。该方法基于铋从碲化铋 (Bi2Te3) 气相渗透导致铜 GB 脆化。 GB 表面的化学分析是通过俄歇电子能谱进行的。 GB组成是在银（其体积浓度为1.4at%）和铜的固溶体中测量的。偏析退火温度为570℃。 GB 破碎表面（其厚度为 5 至 10 个原子层）的银浓度为 4.7 at%。因此，GB内的银浓度与颗粒体积之比（富集系数）约为3.5。
A new method is proposed for measuring the chemical composition of grain boundaries (GBs) in copper-based alloys not prone to embrittlement of boundaries. This method is based on embrittlement of copper GBs by bismuth penetrating from the gas phase of bismuth telluride (Bi2Te3). Chemical analysis of the GB surface is performed via Auger-electron spectroscopy. The GB composition is measured in a solid solution of silver (its volume concentration is 1.4 at %) and copper. The segregation annealing temperature is 570°C. The silver concentration across the broken surface of the GB (its thickness is five to ten atomic layers) is 4.7 at %. Therefore, the ratio between silver concentrations within the GB and the grain volume (the enrichment coefficient) is approximately 3.5.