Topology Optimization of Lightweight Structures With Application to Bone Scaffolds and 3D Printed Shoes for Diabetics

Topology Optimization of Lightweight Structures With Application to Bone Scaffolds and 3D Printed Shoes for Diabetics
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轻质结构的拓扑优化及其在骨支架和糖尿病患者 3D 打印鞋中的应用

DOI:
10.1115/1.4053396
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发表时间:
2022
期刊:
Journal of Applied Mechanics
影响因子:
--
通讯作者:
Dubrowski, Adam
Dubrowski, Adam
中科院分区:
--
文献类型:
--
作者:
Wang, Zhujiang;Srinivasa, Arun;Reddy, J. N.;Dubrowski, Adam

文献摘要

相似文献

提出了一种复杂拓扑轻型结构自动生成方法(ACTLSGM),用于自动生成具有任意形状边界面的轻型桁架结构三维模型。ACTLSGM的核心思想是利用作者开发的PIMesh网格生成算法,在目标复杂拓扑结构的边界面对象内部生成节点分布,然后根据节点分布生成轻质桁架结构毛坯;然后,通过使用基于有限差分法的优化算法调整原始桁架结构的半径,单元桁架分析基于有限元分析的优化算法可以确保得到的结构满足应力分布或刚度的设计要求。三个演示,包括悬臂梁的轻质结构,股骨骨支架和具有自适应刚度的3D鞋底模型,可用于调整糖尿病足部问题患者的足部压力分布,并生成以展示ACTLSGM的性能。ACTLSGM不仅限于生成医疗设备的3D模型,还可以应用于许多其他领域,包括3D打印填充物和其他需要定制轻质结构的领域。
An automatic complex topology lightweight structure generation method (ACTLSGM) is presented to automatically generate 3D models of lightweight truss structures with a boundary surface of any shape. The core idea of the ACTLSGM is to use the PIMesh, a mesh generation algorithm developed by the authors, to generate node distributions inside the object representing the boundary surface of the target complex topology structures; raw lightweight truss structures are then generated based on the node distributions; the resulting lightweight truss structure is then created by adjusting the radius of the raw truss structures using an optimization algorithm based on finite element truss analysis. The finite element analysis-based optimization algorithm can ensure that the resulting structures satisfy the design requirements on stress distributions or stiffness. Three demos, including a lightweight structure for a cantilever beam, a femur bone scaffold, and a 3D shoe sole model with adaptive stiffness, can be used to adjust foot pressure distributions for patients with diabetic foot problems and are generated to demonstrate the performance of the ACTLSGM. The ACTLSGM is not limited to generating 3D models of medical devices, but can be applied in many other fields, including 3D printing infills and other fields where customized lightweight structures are required.