Using Infrared Thermograph of Chip Temperature to Monitor Cutting Edge Performance
Using Infrared Thermograph of Chip Temperature to Monitor Cutting Edge Performance
复制标题
使用芯片温度的红外热像仪监控尖端性能
DOI:
10.4028/www.scientific.net/amm.789-790.549
复制
发表时间:
2015
期刊:
影响因子:
--
通讯作者:
S. Oraby
中科院分区:
文献类型:
--
作者:
M. Alajmi;S. Oraby
Recently, the need arises for new machining inprocess techniques to monitor and/or control machining systems. Due to the introduction of digital thermal noncontact cameras, it becomes possible to assess the chip temperature hence, to evaluate the possible relation between edge performance and variation within such temperature. A noncontact infrared thermal camera is mounted on a turning lathe carriage to record the cutting temperatures as cutting speed and feed vary using both coated and uncoated carbide inserts. Temperatures gradient, along with the relevant SEM micrographs, are analyzed for possible correlation with both regular and irregular cutting edge deformation. While cutting speed proved not to be an influential parameter on the depicted temperatures, feed increase tends to lower cutting temperatures. Generally, it is observed that lower heat and temperatures are generated when coated inserts are employed. It is found that cutting temperatures are gradually increased as edge wear and deformation develop.