The interfacial analysis of a film bonded to a finite thickness graded substrate
The interfacial analysis of a film bonded to a finite thickness graded substrate
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粘合到有限厚度渐变基材的薄膜的界面分析
DOI：
10.1016/j.ijsolstr.2017.04.029
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发表时间：
2017
影响因子：
3.6
通讯作者：
Yang Yugui
中科院分区：
文献类型：
--
作者：
Chen Peijian;Peng Juan;Yu Liyuan;Yang Yugui
研究了不同载荷条件下有限厚度梯度基体与弹性薄膜的粘接问题，其中梯度基体的剪切模量沿其厚度沿着呈指数变化，且在接触界面处采用理想粘接。本模型的控制奇异积分方程解析地表示为界面剪应力。利用配点法对控制方程进行了数值求解。讨论了界面剪应力、薄膜中的正应力以及薄膜边缘附近的奇异性，以评价与薄膜/基体系统失效和破坏密切相关的界面行为。研究发现，通过调节薄膜和梯度衬底的材料和几何参数，可以改变薄膜/衬底系统的界面行为。与非对称加载和对称加载情况相比，一些参数的影响被观察到依赖于加载类型。
The problem of an elastic film bonded to a finite-thickness graded substrate under different loading conditions is investigated, in which the shear modulus of the graded substrate is assumed to vary exponentially along its thickness and perfect adhesion is adopted at the contact interface. The governing singular integral equation for the present model is formulated analytically in terms of interfacial shear stress. With the help of the collocation method, the governing equation is further solved numerically. The interfacial shear stress, the normal stress in the film as well as the singularity near the film edges are discussed in order to evaluate the interface behaviors that are closely related to failure and destruction of the film/substrate systems. It is found that the interface behavior of the film/substrate system can be modified by tuning the material and geometric parameters of both the film and the graded substrate. Compared with cases under a non-symmetric loading and a symmetric one, the effect of some parameters is observed to be dependent of the loading type.