Fabrication of high aspect ratio poly(ethylene glycol)-containing microstructures by UV embossing
Fabrication of high aspect ratio poly(ethylene glycol)-containing microstructures by UV embossing
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DOI：
10.1021/la026967t
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发表时间：
2003-05-13
期刊：
影响因子：
3.9
通讯作者：
Yue, CY
中科院分区：
文献类型：
--
作者：
Chan-Park, MB;Yan, YH;Yue, CY
描述了基于含有聚乙二醇二丙烯酸酯（PEGDA）的混合物的UV压印的高纵横比（5及以上）微结构的制造。UV压花是一种快速方便的复制技术，使用低压和室温。PEGDA的生物相容性以及细胞和蛋白质抗性使得深三维（3-D）微图案化PEGDA膜潜在地可用于许多生物应用，例如蛋白质递送、组织工程、药物递送和生物传感器。深微通道和微杯的微阵列分开的PEGDA壁的纵横比分别为7和5，成功地压花。发现UV压花忠实地复制模具的横向周期性和高度。我们还成功地UV压印了具有相等重量比例的亲水性PEGDA和疏水性聚（丙二醇）二丙烯酸酯的混合物，并证明了使用这种微杯微阵列将模型蛋白（牛血清白蛋白）封装在UV固化的PEGDA水凝胶内;制造了封装在水凝胶3-D微阵列内的蛋白质。虽然高纵横比UV压花具有许多吸引人的特征，但它是一种难以实施的工艺，需要精确控制和优化模具、工艺和材料参数。成功的高纵横比UV压花实现使用两个模具：一个刚性镍模具和硅橡胶模具。后者不需要任何表面处理，但发现镍模具需要用固化的有机硅树脂涂覆以获得合适的不粘表面。控制UV暴露时间以优化硬化树脂强度，同时避免过度脆性。以小角度进行硬化微结构的剥离以避免模制结构的断裂。脱模剂是成功脱模所必需的。三羟甲基丙烷三丙烯酸酯，高收缩单体，也促进脱模。
The fabrication of high aspect ratio (5 and above) microstructures based upon UV embossing of mixtures containing poly(ethylene glycol) diacrylate (PEGDA) is described. UV embossing is a quick and convenient replication technique using low pressure and room temperature. The biocompatibility and cell- and protein-resistance of PEGDA make deep three-dimensional (3-D) micropatterned PEGDA films potentially useful for many biological applications such as protein delivery, tissue engineering, drug delivery, and biosensors. Microarrays of deep microchannels and microcups separated by PEGDA walls with aspect ratios of 7 and 5, respectively, were successfully embossed. UV embossing was found to faithfully replicate the lateral periodicity and height of the mold. We also successfully UV embossed a mixture having equal weight proportions of hydrophilic PEGDA and hydrophobic poly(propylene glycol) diacrylate and demonstrated the use of this microarray of microcups for encapsulation of a model protein (bovine serum albumin) within a UV cured PEGDA hydrogel; a protein encapsulated within a hydrogel 3-D microarray was fabricated. Although high aspect ratio UV embossing has many attractive features, it is a difficult process to implement, requiring precise control and optimization of mold, process, and material parameters. Successful high aspect ratio UV embossing was achieved using two molds: a rigid nickel mold and a silicone rubber mold. The latter did not require any surface treatment, but the nickel mold was found to require coating with a cured silicone resin to obtain a suitable nonstick surface. The UV exposure time was controlled to optimize the hardened resin strength while avoiding excessive brittleness. Peel-off of the hardened microstructures was performed at a small angle to avoid breakage of the molded structures. A mold release additive was necessary for successful demolding. Trimethylolpropane triacrylate, a high shrinkage monomer, also facilitated demolding.