Discussion on Microwave-Matter Interaction Mechanisms by In Situ Observation of "Core-Shell" Microstructure during Microwave Sintering.
Discussion on Microwave-Matter Interaction Mechanisms by In Situ Observation of "Core-Shell" Microstructure during Microwave Sintering.
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通过原位观察微波烧结过程中“核壳”微观结构探讨微波与物质相互作用机制
DOI：
10.3390/ma9030120
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发表时间：
2016-02-23
期刊：
影响因子：
--
通讯作者：
Xiao Y
中科院分区：
文献类型：
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作者：
Liu W;Xu F;Li Y;Hu X;Dong B;Xiao Y
本研究旨在加深对基于原位同步辐射CT的金属-陶瓷体系中微波与物质相互作用机理的理解。首次发现了一种特殊的内部“核-壳”微结构，并将其作为微波与物质相互作用机理的指示剂。首先，证明了微波磁场通过在金属颗粒表面诱导涡流的方式作用于金属颗粒，从而在金属颗粒中形成了核壳结构。在此基础上，提出了陶瓷颗粒可以改变微波场，为微波打开通道，从而导致陶瓷颗粒周围区域的选择性加热，并从陶瓷颗粒周围的“核壳”微结构中得到了验证。此外，还表明陶瓷颗粒聚集了微波，并可能导致金属-陶瓷接触区的局部加热。通过对不同区域“核-壳”结构演化速率的定量分析，证明了微波的聚焦作用。本研究将有助于揭示微波烧结过程中微波-物质相互作用的机理。
This research aims to deepen the understanding of the interaction mechanisms between microwave and matter in a metal-ceramic system based on in situ synchrotron radiation computed tomography. A special internal “core-shell” microstructure was discovered for the first time and used as an indicator for the interaction mechanisms between microwave and matter. Firstly, it was proved that the microwave magnetic field acted on metal particles by way of inducing an eddy current in the surface of the metal particles, which led to the formation of a “core-shell” microstructure in the metal particles. On this basis, it was proposed that the ceramic particles could change the microwave field and open a way for the microwave, thereby leading to selective heating in the region around the ceramic particles, which was verified by the fact that all the “core-shell” microstructure was located around ceramic particles. Furthermore, it was indicated that the ceramic particles would gather the microwaves, and might lead to local heating in the metal-ceramic contact region. The focusing of the microwave was proved by the quantitative analysis of the evolution rate of the “core-shell” microstructure in a different region. This study will help to reveal the microwave-matter interaction mechanisms during microwave sintering.