Microstructure and thermo-mechanical properties of pressureless infiltrated SiCp/Cu composites
Microstructure and thermo-mechanical properties of pressureless infiltrated SiCp/Cu composites
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DOI：
10.1016/j.compscitech.2008.05.018
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发表时间：
2008-10
影响因子：
9.1
通讯作者：
Lin Zhang;X. Qu;B. Duan;Xin-Bo He;S. Ren;Mingli Qin
中科院分区：
文献类型：
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作者：
Lin Zhang;X. Qu;B. Duan;Xin-Bo He;S. Ren;Mingli Qin
研究了无压浸渗法制备的高体积分数（61%）SiCp/Cu复合材料的组织、浸渗机理和热机械性能。结果表明，在金属与SiC预制体的界面处发生了强烈的化学反应.合金元素加速了SiC颗粒的溶解。Si的溶解促进了铜合金在多孔SiC预制体中的浸润和渗透。高浸渗温度和长时间的浸渗会增加界面反应的程度。SiCp/Cu复合材料的热导率相对较低，主要是由于基体的固有热导率较低。弹性模量对合金元素不敏感，而抗弯强度强烈依赖于显微组织特征和基体合金化。SiCp/Cu复合材料的破坏模式为脆性破坏。严重的界面反应会降低材料的力学性能。
The microstructure, infiltration mechanism and thermo-mechanical properties of high volume fraction (61%) SiCp/Cu composites produced by pressureless infiltration were investigated. It is found that intensive chemical reaction occurred at the interface between metal and SiC preform. Alloying elements accelerated the dissolution of SiC particles. It is the dissolution of Si that facilitates the wetting and infiltration of copper alloy into porous SiC preform. High infiltration temperature and long exposure time enhanced the degree of interfacial reaction. Thermal conductivity of SiCp/Cu composites was relatively low, mainly due to the intrinsically low thermal conductivity of the matrix. Elastic modulus is insensitive to alloying elements, while bending strength depends strongly on microstructural characteristics and matrix alloying. SiCp/Cu composites exhibit brittle failure mode. Severe interfacial reaction impaired the mechanical properties.