A comparison of the wettability of copper-copper oxide and silver-copper oxide on polycrystalline alumina
A comparison of the wettability of copper-copper oxide and silver-copper oxide on polycrystalline alumina
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铜-氧化铜和银-氧化铜在多晶氧化铝上润湿性的比较
DOI：
10.1007/bf01154485
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发表时间：
1995
影响因子：
4.5
通讯作者：
G. Edwards
中科院分区：
文献类型：
--
作者：
A. Meier;P. Chidambaram;G. Edwards
采用固滴法测定了液银-氧化铜/氧化铝体系和液铜-氧化铜/氧化铝体系的接触角。氧化铜（CuO）的添加量为1.5-10.0 wt%。银基合金的温度为970 ~ 1250℃，铜基合金的温度为1090 ~ 1300℃。铜-铜氧化物合金和银-铜氧化物合金的最小接触角分别为42±8°和64±7°。在非混相液体成分范围内，银铜氧化物合金的接触角近似恒定。与铜基合金相比，银基合金的接触角更高，而Ag-10 wt% CuO合金在1050°C的温度下成功渗透多孔氧化铝样品。浸渍试样的压缩试验表明，浸渍银-铜氧化物合金、银-铜-铜氧化物合金和铜-铜氧化物合金的氧化铝试样的抗压强度相似。渗透试样的抗压断裂强度比未渗透的多孔氧化铝体的抗压断裂强度高一个数量级。虽然银基合金比可比的铜基合金更昂贵，但在许多应用中，额外的成本可以通过更低的加工或钎焊温度、更好的导热性和导电性以及更好的韧性来抵消。
The contact angles of liquid silver-copper oxide/alumina and liquid copper-copper oxide/alumina systems were determined using the sessile drop method. Copper oxide (CuO) additions of 1.5–10.0 wt% were made. Temperatures of 970–1250 °C for the silver-based alloys and 1090–1300 °C for the copper-based alloys were studied. Minimum contact angles of 42±8 and 64±7 ° were obtained for the copper-copper oxide alloys and the silver-copper oxide alloys, respectively. The contact angle was approximately constant for the silver-copper oxide alloy within the immiscible liquid composition range. While the contact angles were higher for the silver-based alloys relative to the copper-based alloys, successful infiltration of a porous alumina sample was achieved at only 1050 °C for a Ag-10 wt% CuO alloy. Compression tests on infiltrated samples revealed similar compressive strengths for alumina samples infiltrated with silver-copper oxide alloys, silver-copper-copper oxide alloys and copper-copper oxide alloys. The compressive fracture strength for the infiltrated samples was an order of magnitude higher than the fracture strength of the porous alumina body without infiltration. Although silver-based alloys are more expensive than comparable copper-based alloys, in many applications the additional cost may be offset by lower processing or brazing temperatures, improved thermal and electrical conductivity, and improved toughness.