27.4 Physically Unclonable Function in 28nm FD801 Technology Achieving High Reliability for AEC-Q100 Grade 1 and 1SO26262 ASIL-B
27.4 Physically Unclonable Function in 28nm FD801 Technology Achieving High Reliability for AEC-Q100 Grade 1 and 1SO26262 ASIL-B
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27.4 28nm FD801 技术中的物理不可克隆功能实现了 AEC-Q100 Grade 1 和 1SO26262 ASIL-B 的高可靠性
DOI：
10.1109/isscc19947.2020.9063075
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发表时间：
2020
期刊：
影响因子：
--
通讯作者：
M. Noh
中科院分区：
文献类型：
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作者：
Yunhyeok Choi;Bohdan Karpinskyy;Kyoung;Yongsoo Kim;S. Kwon;Jieun Park;Yongki Lee;M. Noh
在当今的数字时代，保护信息至关重要。物理不可克隆函数（PUF）被认为是安全密钥生成的安全方法，因为它们生成仅在操作期间存在的响应。关于使用PUF的挑战是实现高可靠性。因此，各种方案，如时间多数投票[2]，[3]，[4]，空间多数投票[1]，BCH [1]，[3]和老化[3]，被应用于提高响应的稳定性。虽然最近的一篇论文提出了一种实现零误差的氧化物断裂方法[5]，但如果它是真实的PUF，则存在争议，因为可以通过逆向工程观察响应值（即氧化物断裂的状态）。汽车是一个可靠性特别重要的应用领域，因为故障可能导致严重事故。为了满足AEC-Q100 Grade 1的可靠性要求，即使考虑到芯片的老化效应，也必须保证在环境温度（Ta）为−40 ° C至125°C时的功能性。为了满足IS 026262 ASIL-B，故障覆盖率必须超过90%。本文展示了一种满足AEC-Q100 Grade 1和IS 026262 ASIL-B的PUF，其中我们的测试温度范围为结温（Tj）−40 ° C至150°C，以补偿SoC封装内增加的热量。
Protection of information is of paramount importance in today's digital age. Physically Unclonable Functions (PUFs) are considered a secure method for security key generation because they generate responses that exist only during operation. A challenge regarding the use of PUFs is to achieve high reliability. Therefore, various schemes such as temporal majority voting [2], [3], [4], spatial majority voting [1], BCH [1], [3], and burn-in [3], are applied to improve the stability of the responses. While a recent paper proposed a method of oxide-break to achieve zero error [5], it is controversial if it is a real PUF since the response value (i.e. the status of the oxide-break) can be observed by reverse engineering. Automotive is an application area where reliability is particularly important, as failures may lead to critical accidents. To satisfy the reliability of AEC-Q100 Grade 1, functionality under −40-to-125°C in ambient temperature (Ta) must be guaranteed, even considering the aging effects on a chip. To satisfy IS026262 ASIL-B, the fault coverage must be over 90%. This paper shows a PUF satisfying both AEC-Q100 Grade 1 and IS026262 ASIL-B, where our testing temperatures cover −40-to-150°C in junction temperature (Tj) to compensate for the increased thermal heat within the SoC package.