Microfabrication of thermoelectric modules by patterned electrodeposition using a multi-channel glass template
Microfabrication of thermoelectric modules by patterned electrodeposition using a multi-channel glass template
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DOI：
10.1007/s10008-010-1104-y
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发表时间：
2011-03
影响因子：
2.5
通讯作者：
Dawei Liu;Jingfeng Li
中科院分区：
文献类型：
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作者：
Dawei Liu;Jingfeng Li
采用机械加工和热压工艺相结合的方法，在玻璃微模具中组装了具有高深宽比柱体的微尺度热电模块。介绍了一种利用图形化电化学沉积方法在多通道玻璃模具中填充热电材料的方法。反向脉冲电沉积方法被发现有效地克服了深度填充的困难，需要制造具有高纵横比的热电柱。在0.0075 M Bi 3+和0.01 M HTeO 2+的溶液中，采用-200 mV/4 s、+500 mV/1 s和0 mV/3 s（相对于饱和甘汞电极）的脉冲周期制备了高纵横比超过10的N型Bi 2 Te 3阵列。与常见的体材料Bi 2 Te 3相比，沉积的支柱显示出合理的电阻率。
A microfabrication process has been developed to elaborate microscale thermoelectric modules with high-aspect-ratio pillars assembled in a glass micromold, whose multi-channels are formed by combining mechanical machining and hot-pressing processes. This paper describes how to fill the multi-channel glass molds with thermoelectric materials by introducing a patterned electrochemical deposition method, in which a deposition cathode with two series of interdigital electrodes is designed. A reverse-pulsed electrodeposition method is found effective to overcome the difficulty for deep-filling that is required for fabricating thermoelectric pillars with high aspect ratios. A pulse circle of −200 mV for 4 s, +500 mV for 1 s, and 0 mV for 3 s (vs. saturated calomel electrode) was determined for preparing N-type Bi2Te3arrays with a high aspect ratio exceeding ten from a solution containing 0.0075 M Bi3+and 0.01 M HTeO2+. The as-deposited pillars show reasonable electrical resistivity as compared with common bulk Bi2Te3materials.